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Nilsson, J., Borg, J. & Johansson, J. (2019). Correction: Maximal Q Factor for an On-Chip, Fuse-Based Trimmable Capacitor. Electronics, 8(6), Article ID 688.
Open this publication in new window or tab >>Correction: Maximal Q Factor for an On-Chip, Fuse-Based Trimmable Capacitor
2019 (English)In: Electronics, ISSN 2079-9292, Vol. 8, no 6, article id 688Article in journal (Refereed) Published
Place, publisher, year, edition, pages
Basel, Switzerland: MDPI, 2019
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Research subject
Industrial Electronics
Identifiers
urn:nbn:se:ltu:diva-75562 (URN)10.3390/electronics8060688 (DOI)000475354700094 ()
Note

Erratum in: Eletronics, vol.8. nr.1, DOI:10.3390/electronics8010062

Available from: 2019-08-16 Created: 2019-08-16 Last updated: 2019-08-16Bibliographically approved
Nilsson, J., Borg, J. & Johansson, J. (2019). Maximal Q Factor for an On-Chip, Fuse-Based Trimmable Capacitor. Electronics, 8(1), Article ID 62.
Open this publication in new window or tab >>Maximal Q Factor for an On-Chip, Fuse-Based Trimmable Capacitor
2019 (English)In: Electronics, ISSN 2079-9292, Vol. 8, no 1, article id 62Article in journal (Refereed) Published
Abstract [en]

This paper presents a circuit for realising a fuse-programmable capacitor on-chip. The trimming mechanism is implemented using integrated circuit fuses which can be blown in order to lower the resulting equivalent capacitance. However, for integrated circuits, the non-zero fuse resistance for active fuses and finite fuse resistance for blown fuses limit the Q factor of the resulting capacitor. In this work, we present a method on how to arrange the fuses in order to achieve maximal worst-case Q factor for the given circuit topology given the process parameters and requirements on capacitance. We also analyse and discuss the accuracy and limitations of the topology with regard to fuse resistance and parasitic elements such as bond pads.

Place, publisher, year, edition, pages
Basel, Switzerland: MDPI, 2019
Keywords
fuse; resonant circuit; trimmable capacitor; single-chip
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Research subject
Industrial Electronics
Identifiers
urn:nbn:se:ltu:diva-72764 (URN)10.3390/electronics8010062 (DOI)000457142800062 ()2-s2.0-85060151122 (Scopus ID)
Projects
Svenska Kraftnät-projektet
Note

Validerad;2019;Nivå 2;2019-02-25 (inah)

Available from: 2019-02-01 Created: 2019-02-01 Last updated: 2019-04-24Bibliographically approved
Nilsson, J., Borg, J. & Johansson, J. (2018). Chip-Coil Design for Wireless Power Transfer in Power Semiconductor Modules. In: 2018 2nd Conference on PhD Research in Microelectronics and Electronics Latin America (PRIME-LA): . Paper presented at 2nd Conference on PhD Research in Microelectronics and Electronics Latin America (PRIME-LA), Puerto Vallarta, Mexico, 25-28 Feb. 2018. Piscataway, NJ: IEEE
Open this publication in new window or tab >>Chip-Coil Design for Wireless Power Transfer in Power Semiconductor Modules
2018 (English)In: 2018 2nd Conference on PhD Research in Microelectronics and Electronics Latin America (PRIME-LA), Piscataway, NJ: IEEE, 2018Conference paper, Published paper (Refereed)
Abstract [en]

This paper presents electromagnetic simulations of a wireless power transfer system suitable for a monitoring system for detection of solder fatigue in power semiconductor modules. Power is provided wirelessly from a printed spiral coil on a printed circuit board to a silicon chip with an on-chip coil. We use and adapt a known gradient-ascent-based optimisation algorithm to obtain suitable coil geometries. For a frequency of 433 MHz, the simulations show an efficiency of -34.7 dB which we conclude is sufficient for the proposed monitoring system.

Place, publisher, year, edition, pages
Piscataway, NJ: IEEE, 2018
Keywords
CMOS coil, condition monitoring, low power, near-field, on-chip coil, RFID, power semiconductor, wireless
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Research subject
Industrial Electronics
Identifiers
urn:nbn:se:ltu:diva-70717 (URN)10.1109/PRIME-LA.2018.8370384 (DOI)000435003000001 ()2-s2.0-85048899120 (Scopus ID)978-1-5386-4221-4 (ISBN)978-1-5386-4222-1 (ISBN)
Conference
2nd Conference on PhD Research in Microelectronics and Electronics Latin America (PRIME-LA), Puerto Vallarta, Mexico, 25-28 Feb. 2018
Available from: 2018-09-03 Created: 2018-09-03 Last updated: 2019-03-28Bibliographically approved
Borg, J. & Johansson, J. (2017). Delay insensitive signal-injection calibration for large antenna arrays using passive hierarchical networks. IEEE Transactions on Antennas and Propagation, 65(1), 190-195, Article ID 7747455.
Open this publication in new window or tab >>Delay insensitive signal-injection calibration for large antenna arrays using passive hierarchical networks
2017 (English)In: IEEE Transactions on Antennas and Propagation, ISSN 0018-926X, E-ISSN 1558-2221, Vol. 65, no 1, p. 190-195, article id 7747455Article in journal (Refereed) Published
Abstract [en]

Efficient beamforming of phased-array antennas requires that the phase delay of each channel is accurately known. One technique for achieving this is to distribute a calibration or local-oscillator reference signal through a delay-insensitive signal distribution network. In this paper, we propose using passive hierarchical signal distribution networks to distribute such signals, a method that scales significantly better with the size of the array than existing signal distribution methods. We analyze the impact of impedance variations within the network on the phase accuracy and propose a calibration front-end architecture. This front end also enables the return loss and coupling between antennas to be monitored for diagnostic purposes. We present an implementation of this front end that was applied to a small prototype antenna array, and show that this implementation exhibited low sensitivity to delays within the calibration network, reduced the temperature-dependent phase error of the front ends substantially, and can be used for performing antenna return-loss measurements

Place, publisher, year, edition, pages
IEEE, 2017
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Research subject
Industrial Electronics
Identifiers
urn:nbn:se:ltu:diva-61606 (URN)10.1109/TAP.2016.2630504 (DOI)000393788700021 ()2-s2.0-85009164721 (Scopus ID)
Note

Validerad; 2017; Nivå 2; 2017-01-24 (andbra)

Available from: 2017-01-24 Created: 2017-01-24 Last updated: 2018-09-14Bibliographically approved
Nilsson, J., Borg, J. & Johansson, J. (2017). High-temperature characterisation and analysis of leakage-current-compensated, low-power bandgap temperature sensors. Analog Integrated Circuits and Signal Processing, 93(1), 137-147
Open this publication in new window or tab >>High-temperature characterisation and analysis of leakage-current-compensated, low-power bandgap temperature sensors
2017 (English)In: Analog Integrated Circuits and Signal Processing, ISSN 0925-1030, E-ISSN 1573-1979, Vol. 93, no 1, p. 137-147Article in journal (Refereed) Published
Abstract [en]

This paper analyses leakage current compensation techniques for low-power, bandgap temperature sensors. Experiments are conducted for circuits that compensate for collector-substrate, collector-base, body-drain and source-body leakage currents in a Brokaw bandgap sensor. The sensors are characterised and their failure modes are analysed at temperatures from 60 to 230∘C">230 ∘ C 230∘C . It is found that the most appropriate compensation circuit depends on the accuracy requirements of the application and on whether a stable reference voltage is required by other parts of the circuit. Experiments show that the power consumption is dominated by leakage current at high temperatures. One type of sensor was seen to consume 260 nW at 60∘C">60 ∘ C 60∘C , 2.1μW">2.1μW 2.1μW at 200∘C">200 ∘ C 200∘C and 14μW">14μW 14μW at 230∘C">230 ∘ C 230∘C . This work is motivated by the need to accurately monitor the temperature of power semiconductors in order to predict emerging faults in power semiconductor modules, a task for which cheap, single-chip, low-power, high-temperature, wireless bandgap temperature sensors are appropriate.

Place, publisher, year, edition, pages
Springer, 2017
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Research subject
Industrial Electronics
Identifiers
urn:nbn:se:ltu:diva-64629 (URN)10.1007/s10470-017-1011-6 (DOI)000410451100013 ()2-s2.0-85025077050 (Scopus ID)
Note

Validerad;2017;Nivå 2;2017-09-26 (andbra)

Available from: 2017-06-29 Created: 2017-06-29 Last updated: 2019-03-28Bibliographically approved
Barabash, V., Ejemalm, J., Kuhn, T., Milz, M., Molin, S., Johansson, J. & Westerberg, L.-G. (2017). Masters Programs in Space Science and Engineering in Northern Sweden. In: : . Paper presented at 68th International Astronautical Congress, Adelaide, Australia, 25 – 29 September 2017 (pp. 11179-11191).
Open this publication in new window or tab >>Masters Programs in Space Science and Engineering in Northern Sweden
Show others...
2017 (English)Conference paper, Published paper (Refereed)
Keywords
rymd, space, Master, education, engineering
National Category
Aerospace Engineering Other Electrical Engineering, Electronic Engineering, Information Engineering Fluid Mechanics and Acoustics
Research subject
Atmospheric science; Industrial Electronics; Fluid Mechanics
Identifiers
urn:nbn:se:ltu:diva-65521 (URN)2-s2.0-85051439897 (Scopus ID)9781510855373 (ISBN)
Conference
68th International Astronautical Congress, Adelaide, Australia, 25 – 29 September 2017
Projects
342
Available from: 2017-09-07 Created: 2017-09-07 Last updated: 2018-08-23Bibliographically approved
Delsing, J., van Deventer, J., Eliasson, J., Johansson, J., Löfqvist, T. & Sandin, F. (2016). Concepts and Architecture for a Thumb-Sized Smart IoT Ultrasound Measurement System. In: IEEE Ultrasonic Symposium 2016: . Paper presented at IEEE Ultrasonic Symposium, Tours, France, 18-21 Sep 2016. Piscataway, NJ: IEEE conference proceedings
Open this publication in new window or tab >>Concepts and Architecture for a Thumb-Sized Smart IoT Ultrasound Measurement System
Show others...
2016 (English)In: IEEE Ultrasonic Symposium 2016, Piscataway, NJ: IEEE conference proceedings, 2016Conference paper, Published paper (Refereed)
Abstract [en]

This paper presents the technology concepts for a “thumb”-sized self-contained ultrasonic IoT measurement sys- tem. An overall architecture is proposed, and key elements are discussed with solutions using existing technology, thus arguing that realization is possible with the current technology.

Such an ultrasonic IoT measurement system is constrained by its size and available energy, although it requires at least decent computational and communication resources. Because streaming data from such a device is not advisable from an energy viewpoint, there is a need for resource efficient (energy, memory and computational power) data analysis.

An architecture with the following parts as well as some implementation details and performance data are proposed here:

  • Energy supply, battery and super capacitor

  • Transducer excitation achieving almost zero electrical losses

  • Event detection sensor interface

  • Data aggregation using sparse approximation and learned

    feature dictionaries, adapted to resource constrained em-

    bedded systems

  • IoT communication protocols and implementations enabling

    event -based communication and System of Systems integra- tion capabilities

    The optimization of system level performance requires each subsystem to be optimized for the specific measurement situation taking into account the subsystem interdependencies. This can be performed using a combined electrical and acoustical model of the system. Here, the model allowing electronic and acoustic co-simulation using SPICE is an important tool bridging the electronic and acoustic domains. 

Place, publisher, year, edition, pages
Piscataway, NJ: IEEE conference proceedings, 2016
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Research subject
Industrial Electronics
Identifiers
urn:nbn:se:ltu:diva-59677 (URN)10.1109/ULTSYM.2016.7728708 (DOI)978-1-4799-8182-3 (ISBN)978-1-4673-9897-8 (ISBN)
Conference
IEEE Ultrasonic Symposium, Tours, France, 18-21 Sep 2016
Projects
Arrowhead
Available from: 2016-10-12 Created: 2016-10-12 Last updated: 2018-06-11Bibliographically approved
Johansson, J. & Borg, J. (2016). Encapsulation method for smallwireless measurement systems in high temperature environments. In: : . Paper presented at IMAPS International Conference and Exhibition on High Temperature Electronics, HiTEC 2016, Albuquerque, 10-12 May 2016. IMAPS-International Microelectronics and Packaging Society
Open this publication in new window or tab >>Encapsulation method for smallwireless measurement systems in high temperature environments
2016 (English)Conference paper, Published paper (Refereed)
Abstract [en]

This paper presents an encapsulation concept that enables the construction of small wireless measurement systems that can operate in industrial environments with ambient temperatures of up to 1200°C. To maximize operational time and minimize size, a layer of thermal insulation is combined with water absorbed in a porous material in the core of the device. The simulated operating time before all of the frozen water at 0?C has transformed into steam at 100°C when the ambient temperature of the device was 1200°C is 21 minutes for a sphere with an outer radius of 4 cm. If the outer radius is increased to 10 cm the simulated operating time increases to 125 minutes. Measurements were performed to validate the design. When a sphere with a radius of 4 cm was subjected to an oven temperature of 1200°C the device held the core temperature at or below 101°C for a total of 25 minutes. The time to reach the boiling point of the water was 9 minutes. Thereafter, the temperature was held constant at 100 +/- 1°C for an additional 16 minutes whereafter a rapid rise in temperature took place once all water had evaporated.

Place, publisher, year, edition, pages
IMAPS-International Microelectronics and Packaging Society, 2016
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Research subject
Industrial Electronics
Identifiers
urn:nbn:se:ltu:diva-60878 (URN)10.4071/2016-HITEC-87 (DOI)2-s2.0-84995611743 (Scopus ID)
Conference
IMAPS International Conference and Exhibition on High Temperature Electronics, HiTEC 2016, Albuquerque, 10-12 May 2016
Projects
Integrated Process Control based on Distributed In-Situ Sensors into Raw Material and Energy Feedstock, DISIRE
Funder
EU, Horizon 2020, 636834
Available from: 2016-12-02 Created: 2016-12-02 Last updated: 2018-06-11Bibliographically approved
Fischer, J., Borg, J. & Johansson, J. (2016). High frequency limitations of active rectifier circuits for RFID applications (ed.). In: (Ed.), 2016 MIXDES: 23rd International Conference Mixed Design of Integrated Circuits and Systems, Lodz, Poland, 23-25 June 2016. Paper presented at International Conference Mixdes Design of Integrated Circuits and Systems : 23/06/2016 - 25/06/2016 (pp. 326-329). Piscataway, NJ: IEEE Communications Society, Article ID 7529757.
Open this publication in new window or tab >>High frequency limitations of active rectifier circuits for RFID applications
2016 (English)In: 2016 MIXDES: 23rd International Conference Mixed Design of Integrated Circuits and Systems, Lodz, Poland, 23-25 June 2016, Piscataway, NJ: IEEE Communications Society, 2016, p. 326-329, article id 7529757Conference paper, Published paper (Refereed)
Abstract [en]

This paper analyses the frequency limitations of an active rectifier for RFID applications that has been optimised for 13.56 MHz. The rectifier utilises an active MOS diode with threshold cancellation and a control scheme to reduce reverse leakage. The rectifier is implemented in AMS 0.35 µm CMOS and simulated in Cadence Spectre. For an input voltage of 2 V and an output current of 20 µA, a power and voltage conversion efficiency of 83 % and 89 %, respectively, are achieved at 13.56 MHz. We show that reducing the width of the main MOS transistor from 90 to 60 µm improves the upper frequency limit, but beyond 30 MHz the finite speed of the threshold cancellation control circuit limits the efficiency of the rectifier circuit.

Place, publisher, year, edition, pages
Piscataway, NJ: IEEE Communications Society, 2016
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Research subject
Industrial Electronics
Identifiers
urn:nbn:se:ltu:diva-38202 (URN)10.1109/MIXDES.2016.7529757 (DOI)000383221700061 ()2-s2.0-84992125227 (Scopus ID)c84fbff7-05dd-47d6-9821-3cdae82bc4fd (Local ID)c84fbff7-05dd-47d6-9821-3cdae82bc4fd (Archive number)c84fbff7-05dd-47d6-9821-3cdae82bc4fd (OAI)
Conference
International Conference Mixdes Design of Integrated Circuits and Systems : 23/06/2016 - 25/06/2016
Projects
Integrated Process Control based on Distributed In-Situ Sensors into Raw Material and Energy Feedstock, DISIRE
Funder
EU, Horizon 2020, 636834
Note

Validerad; 2016; Nivå 1; 2016-10-13 (andbra)

Available from: 2016-10-03 Created: 2016-10-03 Last updated: 2018-06-11Bibliographically approved
Rabén, H., Johansson, J. & Borg, J. (2015). A CMOS Front-end for RFID Transponders Using Multiple Coil Antennas (ed.). Paper presented at . Analog Integrated Circuits and Signal Processing, 83(2), 149-159
Open this publication in new window or tab >>A CMOS Front-end for RFID Transponders Using Multiple Coil Antennas
2015 (English)In: Analog Integrated Circuits and Signal Processing, ISSN 0925-1030, E-ISSN 1573-1979, Vol. 83, no 2, p. 149-159Article in journal (Refereed) Published
Abstract [en]

A front-end architecture for inductive RFID transponders using multiple coil antennas for reduced ori- entation sensitivity is presented. The front-end uses multiple antennas for reception and one antenna for transmission. A select function identifies the antenna that is most favorably oriented toward the reader for transmission by comparing the DC charge-up phases of multiple DC generation blocks during power-up of the transponder. CMOS circuit design and simulation results of a front-end for 125 kHz FSK modulation are presented for a pulsed RFID system as well as an archi- tecture for cascaded DC generation. This paper also includes an example of a coil antenna for spherical transponders using three independent orthogonal windings.

National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Research subject
Industrial Electronics
Identifiers
urn:nbn:se:ltu:diva-5038 (URN)10.1007/s10470-015-0518-y (DOI)000353358800004 ()2-s2.0-84937763608 (Scopus ID)30f00f70-28c0-4400-923a-81773e09c2fa (Local ID)30f00f70-28c0-4400-923a-81773e09c2fa (Archive number)30f00f70-28c0-4400-923a-81773e09c2fa (OAI)
Note
Validerad; 2015; Nivå 2; 20140904 (hanrab)Available from: 2016-09-29 Created: 2016-09-29 Last updated: 2018-07-10Bibliographically approved
Organisations
Identifiers
ORCID iD: ORCID iD iconorcid.org/0000-0003-4958-146x

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