Change search
Link to record
Permanent link

Direct link
BETA
Borg, Johan
Publications (10 of 38) Show all publications
Nilsson, J., Borg, J. & Johansson, J. (2018). Chip-Coil Design for Wireless Power Transfer in Power Semiconductor Modules. In: 2018 2nd Conference on PhD Research in Microelectronics and Electronics Latin America (PRIME-LA): . Paper presented at 2nd Conference on PhD Research in Microelectronics and Electronics Latin America (PRIME-LA), Puerto Vallarta, Mexico, 25-28 Feb. 2018. Piscataway, NJ: IEEE
Open this publication in new window or tab >>Chip-Coil Design for Wireless Power Transfer in Power Semiconductor Modules
2018 (English)In: 2018 2nd Conference on PhD Research in Microelectronics and Electronics Latin America (PRIME-LA), Piscataway, NJ: IEEE, 2018Conference paper, Published paper (Refereed)
Abstract [en]

This paper presents electromagnetic simulations of a wireless power transfer system suitable for a monitoring system for detection of solder fatigue in power semiconductor modules. Power is provided wirelessly from a printed spiral coil on a printed circuit board to a silicon chip with an on-chip coil. We use and adapt a known gradient-ascent-based optimisation algorithm to obtain suitable coil geometries. For a frequency of 433 MHz, the simulations show an efficiency of -34.7 dB which we conclude is sufficient for the proposed monitoring system.

Place, publisher, year, edition, pages
Piscataway, NJ: IEEE, 2018
Keywords
CMOS coil, condition monitoring, low power, near-field, on-chip coil, RFID, power semiconductor, wireless
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Research subject
Industrial Electronics
Identifiers
urn:nbn:se:ltu:diva-70717 (URN)10.1109/PRIME-LA.2018.8370384 (DOI)000435003000001 ()2-s2.0-85048899120 (Scopus ID)978-1-5386-4221-4 (ISBN)978-1-5386-4222-1 (ISBN)
Conference
2nd Conference on PhD Research in Microelectronics and Electronics Latin America (PRIME-LA), Puerto Vallarta, Mexico, 25-28 Feb. 2018
Available from: 2018-09-03 Created: 2018-09-03 Last updated: 2019-03-28Bibliographically approved
Borg, J. & Johansson, J. (2017). Delay insensitive signal-injection calibration for large antenna arrays using passive hierarchical networks. IEEE Transactions on Antennas and Propagation, 65(1), 190-195, Article ID 7747455.
Open this publication in new window or tab >>Delay insensitive signal-injection calibration for large antenna arrays using passive hierarchical networks
2017 (English)In: IEEE Transactions on Antennas and Propagation, ISSN 0018-926X, E-ISSN 1558-2221, Vol. 65, no 1, p. 190-195, article id 7747455Article in journal (Refereed) Published
Abstract [en]

Efficient beamforming of phased-array antennas requires that the phase delay of each channel is accurately known. One technique for achieving this is to distribute a calibration or local-oscillator reference signal through a delay-insensitive signal distribution network. In this paper, we propose using passive hierarchical signal distribution networks to distribute such signals, a method that scales significantly better with the size of the array than existing signal distribution methods. We analyze the impact of impedance variations within the network on the phase accuracy and propose a calibration front-end architecture. This front end also enables the return loss and coupling between antennas to be monitored for diagnostic purposes. We present an implementation of this front end that was applied to a small prototype antenna array, and show that this implementation exhibited low sensitivity to delays within the calibration network, reduced the temperature-dependent phase error of the front ends substantially, and can be used for performing antenna return-loss measurements

Place, publisher, year, edition, pages
IEEE, 2017
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Research subject
Industrial Electronics
Identifiers
urn:nbn:se:ltu:diva-61606 (URN)10.1109/TAP.2016.2630504 (DOI)000393788700021 ()2-s2.0-85009164721 (Scopus ID)
Note

Validerad; 2017; Nivå 2; 2017-01-24 (andbra)

Available from: 2017-01-24 Created: 2017-01-24 Last updated: 2018-09-14Bibliographically approved
Johansson, J. & Borg, J. (2016). Encapsulation method for smallwireless measurement systems in high temperature environments. In: : . Paper presented at IMAPS International Conference and Exhibition on High Temperature Electronics, HiTEC 2016, Albuquerque, 10-12 May 2016. IMAPS-International Microelectronics and Packaging Society
Open this publication in new window or tab >>Encapsulation method for smallwireless measurement systems in high temperature environments
2016 (English)Conference paper, Published paper (Refereed)
Abstract [en]

This paper presents an encapsulation concept that enables the construction of small wireless measurement systems that can operate in industrial environments with ambient temperatures of up to 1200°C. To maximize operational time and minimize size, a layer of thermal insulation is combined with water absorbed in a porous material in the core of the device. The simulated operating time before all of the frozen water at 0?C has transformed into steam at 100°C when the ambient temperature of the device was 1200°C is 21 minutes for a sphere with an outer radius of 4 cm. If the outer radius is increased to 10 cm the simulated operating time increases to 125 minutes. Measurements were performed to validate the design. When a sphere with a radius of 4 cm was subjected to an oven temperature of 1200°C the device held the core temperature at or below 101°C for a total of 25 minutes. The time to reach the boiling point of the water was 9 minutes. Thereafter, the temperature was held constant at 100 +/- 1°C for an additional 16 minutes whereafter a rapid rise in temperature took place once all water had evaporated.

Place, publisher, year, edition, pages
IMAPS-International Microelectronics and Packaging Society, 2016
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Research subject
Industrial Electronics
Identifiers
urn:nbn:se:ltu:diva-60878 (URN)10.4071/2016-HITEC-87 (DOI)2-s2.0-84995611743 (Scopus ID)
Conference
IMAPS International Conference and Exhibition on High Temperature Electronics, HiTEC 2016, Albuquerque, 10-12 May 2016
Projects
Integrated Process Control based on Distributed In-Situ Sensors into Raw Material and Energy Feedstock, DISIRE
Funder
EU, Horizon 2020, 636834
Available from: 2016-12-02 Created: 2016-12-02 Last updated: 2018-06-11Bibliographically approved
Fischer, J., Borg, J. & Johansson, J. (2016). High frequency limitations of active rectifier circuits for RFID applications (ed.). In: (Ed.), 2016 MIXDES: 23rd International Conference Mixed Design of Integrated Circuits and Systems, Lodz, Poland, 23-25 June 2016. Paper presented at International Conference Mixdes Design of Integrated Circuits and Systems : 23/06/2016 - 25/06/2016 (pp. 326-329). Piscataway, NJ: IEEE Communications Society, Article ID 7529757.
Open this publication in new window or tab >>High frequency limitations of active rectifier circuits for RFID applications
2016 (English)In: 2016 MIXDES: 23rd International Conference Mixed Design of Integrated Circuits and Systems, Lodz, Poland, 23-25 June 2016, Piscataway, NJ: IEEE Communications Society, 2016, p. 326-329, article id 7529757Conference paper, Published paper (Refereed)
Abstract [en]

This paper analyses the frequency limitations of an active rectifier for RFID applications that has been optimised for 13.56 MHz. The rectifier utilises an active MOS diode with threshold cancellation and a control scheme to reduce reverse leakage. The rectifier is implemented in AMS 0.35 µm CMOS and simulated in Cadence Spectre. For an input voltage of 2 V and an output current of 20 µA, a power and voltage conversion efficiency of 83 % and 89 %, respectively, are achieved at 13.56 MHz. We show that reducing the width of the main MOS transistor from 90 to 60 µm improves the upper frequency limit, but beyond 30 MHz the finite speed of the threshold cancellation control circuit limits the efficiency of the rectifier circuit.

Place, publisher, year, edition, pages
Piscataway, NJ: IEEE Communications Society, 2016
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Research subject
Industrial Electronics
Identifiers
urn:nbn:se:ltu:diva-38202 (URN)10.1109/MIXDES.2016.7529757 (DOI)000383221700061 ()2-s2.0-84992125227 (Scopus ID)c84fbff7-05dd-47d6-9821-3cdae82bc4fd (Local ID)c84fbff7-05dd-47d6-9821-3cdae82bc4fd (Archive number)c84fbff7-05dd-47d6-9821-3cdae82bc4fd (OAI)
Conference
International Conference Mixdes Design of Integrated Circuits and Systems : 23/06/2016 - 25/06/2016
Projects
Integrated Process Control based on Distributed In-Situ Sensors into Raw Material and Energy Feedstock, DISIRE
Funder
EU, Horizon 2020, 636834
Note

Validerad; 2016; Nivå 1; 2016-10-13 (andbra)

Available from: 2016-10-03 Created: 2016-10-03 Last updated: 2018-06-11Bibliographically approved
Rabén, H., Johansson, J. & Borg, J. (2015). A CMOS Front-end for RFID Transponders Using Multiple Coil Antennas (ed.). Paper presented at . Analog Integrated Circuits and Signal Processing, 83(2), 149-159
Open this publication in new window or tab >>A CMOS Front-end for RFID Transponders Using Multiple Coil Antennas
2015 (English)In: Analog Integrated Circuits and Signal Processing, ISSN 0925-1030, E-ISSN 1573-1979, Vol. 83, no 2, p. 149-159Article in journal (Refereed) Published
Abstract [en]

A front-end architecture for inductive RFID transponders using multiple coil antennas for reduced ori- entation sensitivity is presented. The front-end uses multiple antennas for reception and one antenna for transmission. A select function identifies the antenna that is most favorably oriented toward the reader for transmission by comparing the DC charge-up phases of multiple DC generation blocks during power-up of the transponder. CMOS circuit design and simulation results of a front-end for 125 kHz FSK modulation are presented for a pulsed RFID system as well as an archi- tecture for cascaded DC generation. This paper also includes an example of a coil antenna for spherical transponders using three independent orthogonal windings.

National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Research subject
Industrial Electronics
Identifiers
urn:nbn:se:ltu:diva-5038 (URN)10.1007/s10470-015-0518-y (DOI)000353358800004 ()2-s2.0-84937763608 (Scopus ID)30f00f70-28c0-4400-923a-81773e09c2fa (Local ID)30f00f70-28c0-4400-923a-81773e09c2fa (Archive number)30f00f70-28c0-4400-923a-81773e09c2fa (OAI)
Note
Validerad; 2015; Nivå 2; 20140904 (hanrab)Available from: 2016-09-29 Created: 2016-09-29 Last updated: 2018-07-10Bibliographically approved
Alrifaiy, A., Borg, J., Lindahl, O. & Ramser, K. (2015). A lab-on-a-chip for hypoxic patch clamp measurements combined with optical tweezers and spectroscopy: first investigations of single biological cells (ed.). Paper presented at . Biomedical engineering online, 14, Article ID 36.
Open this publication in new window or tab >>A lab-on-a-chip for hypoxic patch clamp measurements combined with optical tweezers and spectroscopy: first investigations of single biological cells
2015 (English)In: Biomedical engineering online, ISSN 1475-925X, E-ISSN 1475-925X, Vol. 14, article id 36Article in journal (Refereed) Published
Abstract [en]

The response and the reaction of the brain system to hypoxia is a vital research subject that requires special instrumentation. With this research subject in focus, a new multifunctional lab-on-a-chip (LOC) system with control over the oxygen content for studies on biological cells was developed. The chip was designed to incorporate the patch clamp technique, optical tweezers and absorption spectroscopy. The performance of the LOC was tested by a series of experiments. The oxygen content within the channels of the LOC was monitored by an oxygen sensor and verified by simultaneously studying the oxygenation state of chicken red blood cells (RBCs) with absorption spectra. The chicken RBCs were manipulated optically and steered in three dimensions towards a patch-clamp micropipette in a closed microfluidic channel. The oxygen level within the channels could be changed from a normoxic value of 18% O 2 to an anoxic value of 0.0-0.5% O 2. A time series of 3 experiments were performed, showing that the spectral transfer from the oxygenated to the deoxygenated state occurred after about 227 ± 1 s and a fully developed deoxygenated spectrum was observed after 298 ± 1 s, a mean value of 3 experiments. The tightness of the chamber to oxygen diffusion was verified by stopping the flow into the channel system while continuously recording absorption spectra showing an unchanged deoxygenated state during 5400 ± 2 s. A transfer of the oxygenated absorption spectra was achieved after 426 ± 1 s when exposing the cell to normoxic buffer. This showed the long time viability of the investigated cells. Successful patching and sealing were established on a trapped RBC and the whole-cell access (Ra) and membrane (Rm) resistances were measured to be 5.033 ± 0.412 M Ω and 889.7 ± 1.74 M Ω respectively.

National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering Applied Mechanics
Research subject
Industrial Electronics; Experimental Mechanics
Identifiers
urn:nbn:se:ltu:diva-15236 (URN)10.1186/s12938-015-0024-6 (DOI)000353330300001 ()25907197 (PubMedID)2-s2.0-84928337538 (Scopus ID)ebc3778e-f4fc-49c8-a1c0-bf991c7677d6 (Local ID)ebc3778e-f4fc-49c8-a1c0-bf991c7677d6 (Archive number)ebc3778e-f4fc-49c8-a1c0-bf991c7677d6 (OAI)
Note
Validerad; 2015; Nivå 2; 20150428 (andbra)Available from: 2016-09-29 Created: 2016-09-29 Last updated: 2018-07-10Bibliographically approved
Nilsson, J., Borg, J. & Johansson, J. (2015). Leakage Current Compensation for a 450 nW, High Temperature, Bandgap Temperature Sensor (ed.). In: (Ed.), (Ed.), Proceedings of the 19th International Conference Mixed Design of Integrated Circuits and Systems - MIXDES 2015: . Paper presented at International Conference of Mixed Design of Integrated Circuits and Systems : 25/06/2015 - 27/06/2015 (pp. 343-347). Piscataway, NJ: IEEE Communications Society, Article ID 7208540.
Open this publication in new window or tab >>Leakage Current Compensation for a 450 nW, High Temperature, Bandgap Temperature Sensor
2015 (English)In: Proceedings of the 19th International Conference Mixed Design of Integrated Circuits and Systems - MIXDES 2015, Piscataway, NJ: IEEE Communications Society, 2015, p. 343-347, article id 7208540Conference paper, Published paper (Refereed)
Abstract [en]

The design of a 450 nW bandgap temperature sensor in the 0 to 175 °C range is presented. The design demonstrates a leakage current compensation technique that is useful for low-power designs where transistor performance is limited. The technique mitigates the effects of leakage in Brokaw bandgap references by limiting the amount of excess current that is entering the bases of the main bipolar pair due to leakage. Using this technique, Monte Carlo simulations show an improvement factor of 7.6 for the variation of the temperature sensitivity over the full temperature range. For the variation of the reference voltage, Monte Carlo simulations show an improvement factor of 2.3.Sensors built using this technique can be used to accurately monitor the temperature of power semiconductors since wireless temperature sensors become feasible with sufficiently low power consumption.

Abstract [en]

The design of a 450 nW bandgap temperature sensor in the 0 to 175 °C range is presented. The design demonstrates a leakage current compensation technique that is useful for low power designs where transistor performance is limited. The technique mitigates the effects of leakage in Brokaw bandgap references by limiting the amount of excess current that is entering the bases of the main bipolar pair due to leakage. Using this technique, Monte Carlo simulations show an improvement factor of 7.6 for the variation of the temperature sensitivity over the full temperature range. For the variation of the reference voltage, Monte Carlo simulations show an improvement factor of 2.3. Sensors built using this technique can be used to accurately monitor the temperature of power semiconductors since wireless direct-contact temperature sensors become feasible with sufficiently low power consumption.

Place, publisher, year, edition, pages
Piscataway, NJ: IEEE Communications Society, 2015
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Research subject
Industrial Electronics
Identifiers
urn:nbn:se:ltu:diva-28487 (URN)10.1109/MIXDES.2015.7208540 (DOI)84953744489 (Scopus ID)24e0418c-cdb6-4a99-b49f-f70e44121e89 (Local ID)978-83-63578-06-0 (ISBN)24e0418c-cdb6-4a99-b49f-f70e44121e89 (Archive number)24e0418c-cdb6-4a99-b49f-f70e44121e89 (OAI)
Conference
International Conference of Mixed Design of Integrated Circuits and Systems : 25/06/2015 - 27/06/2015
Note
Validerad; 2015; Nivå 1; 20150507 (joanil)Available from: 2016-09-30 Created: 2016-09-30 Last updated: 2019-03-28Bibliographically approved
Borg, J. (2015). Performance and spatial sensitivity variations of single photon avalanche diodes manufactured in an image sensor CMOS process (ed.). Paper presented at . IEEE Electron Device Letters, 36(11), 1118-1120
Open this publication in new window or tab >>Performance and spatial sensitivity variations of single photon avalanche diodes manufactured in an image sensor CMOS process
2015 (English)In: IEEE Electron Device Letters, ISSN 0741-3106, E-ISSN 1558-0563, Vol. 36, no 11, p. 1118-1120Article in journal (Refereed) Published
Abstract [en]

In this letter we present the results from a series of single-photon avalanche diode (SPAD) structures implemented in a commercial 0.18 μm CMOS process intended for CMOS image sensors. Variations without effect on the performance and variations that produced non-functional devices are described. Devices based on the P+/NWELL and deep-NWELL/P-EPI SPADs junctions were found to work well in this process. When biased for 10% QE the best 10 μm diameter P+/NWELL SPADs exhibited a DCR of about 1 kHz, whereas the DCR of the deep-NWELL/P-EPI SPADs was only 10 Hz under the same conditions. We also show that the former type exhibited local sensitivity variations within the SPADs ranging from a factor 4 at low excess voltage to 1.2 at an excess voltage of about 0.5 V. No significant sensitivity variations were found for the deep- NWELL/P-EPI SPADs, but they were found to exhibit significant sensitivity outside the central junction, contributing from 8.3 % at low excess voltage to approximately 70% at high excess voltage

National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Research subject
Industrial Electronics
Identifiers
urn:nbn:se:ltu:diva-9373 (URN)10.1109/LED.2015.2475168 (DOI)000364094300003 ()2-s2.0-84946570515 (Scopus ID)7fb9abf9-161d-47a6-84ba-5304c91833d3 (Local ID)7fb9abf9-161d-47a6-84ba-5304c91833d3 (Archive number)7fb9abf9-161d-47a6-84ba-5304c91833d3 (OAI)
Note
Validerad; 2015; Nivå 2; 20150901 (andbra)Available from: 2016-09-29 Created: 2016-09-29 Last updated: 2018-07-10Bibliographically approved
Nilsson, J., Borg, J. & Johansson, J. (2015). Single Chip Wireless Condition Monitoring of Power Semiconductor Modules (ed.). In: (Ed.), (Ed.), Nordic Circuits and Systems Conference (NORCAS): NORCHIP & International Symposium on System-on-Chip (SoC), 2015. Paper presented at Nordic Circuits and Systems Conference (NORCAS): NORCHIP & International Symposium on System-on-Chip (SoC), 2015 : 26/10/2015 - 28/10/2015. Piscataway, NJ: IEEE Communications Society, Article ID 7364407.
Open this publication in new window or tab >>Single Chip Wireless Condition Monitoring of Power Semiconductor Modules
2015 (English)In: Nordic Circuits and Systems Conference (NORCAS): NORCHIP & International Symposium on System-on-Chip (SoC), 2015, Piscataway, NJ: IEEE Communications Society, 2015, article id 7364407Conference paper, Published paper (Refereed)
Abstract [en]

A concept for doing accurate monitoring of temperature in power semiconductor modules is proposed. The concept involves glueing wireless single-chip temperature sensors with on-chip coils in direct contact with power semiconductor devices within their modules. Direct contact results in accurate temperature measurements while wireless technology such as RFID provides galvanic isolation from the power devices. An overview of the electromagnetic situation within wire bond power semiconductor modules is presented and a prototype chip with an on-chip coil has been manufactured as an initial attempt to investigate the feasibility of the concept. Measurements on said chip provides some insight in the challenges in on-chip coil designs. The feasibility of the concept is supported by earlier work that have demonstrated high power transfer efficiencies and a low power temperature sensor that is able to operate at high temperatures.

Place, publisher, year, edition, pages
Piscataway, NJ: IEEE Communications Society, 2015
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Research subject
Industrial Electronics
Identifiers
urn:nbn:se:ltu:diva-28555 (URN)10.1109/NORCHIP.2015.7364407 (DOI)2-s2.0-84963716626 (Scopus ID)262849d9-384e-4db1-a463-d5b45ad7f229 (Local ID)978-1-4673-6576-5 (ISBN)262849d9-384e-4db1-a463-d5b45ad7f229 (Archive number)262849d9-384e-4db1-a463-d5b45ad7f229 (OAI)
Conference
Nordic Circuits and Systems Conference (NORCAS): NORCHIP & International Symposium on System-on-Chip (SoC), 2015 : 26/10/2015 - 28/10/2015
Note
Validerad; 2016; Nivå 1; 20160111 (joanil)Available from: 2016-09-30 Created: 2016-09-30 Last updated: 2019-03-28Bibliographically approved
Beckman, C., Borg, J., Johansson, J. & Tecsor, I. (2014). Design considerations for the EISCAT-3D phased array antenna (ed.). In: (Ed.), (Ed.), 2014 8th European Conference on Antennas and Propagation: (EuCAP); The Hague; Netherlands, 6 -11 April 2014. Paper presented at European Conference on Antennas and Propagation : 06/04/2014 - 11/04/2014 (pp. 1700-1704). Piscataway, NJ: IEEE Communications Society
Open this publication in new window or tab >>Design considerations for the EISCAT-3D phased array antenna
2014 (English)In: 2014 8th European Conference on Antennas and Propagation: (EuCAP); The Hague; Netherlands, 6 -11 April 2014, Piscataway, NJ: IEEE Communications Society, 2014, p. 1700-1704Conference paper, Published paper (Refereed)
Abstract [en]

This paper presents a background and an overview of the initial design considerations for phased array antenna being designed for the New Generation multi-static, incoherent-scatter radar station - EISCAT-3D - in Northern Scandinavia. Its anticipated electrical, mechanical and environmental design requirements are given both by the physics as well as by the extreme climate in the subarctic region of northern Scandinavia

Place, publisher, year, edition, pages
Piscataway, NJ: IEEE Communications Society, 2014
Series
Proceedings of the European Conference on Antennas and Propagation. European Conference on Antennas and Propagation, ISSN 2164-3342
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Research subject
Industrial Electronics
Identifiers
urn:nbn:se:ltu:diva-34590 (URN)10.1109/EuCAP.2014.6902117 (DOI)2-s2.0-84908611003 (Scopus ID)8d3d796b-5d1f-461d-9044-4910bdd6ba36 (Local ID)9788890701849 (ISBN)8d3d796b-5d1f-461d-9044-4910bdd6ba36 (Archive number)8d3d796b-5d1f-461d-9044-4910bdd6ba36 (OAI)
Conference
European Conference on Antennas and Propagation : 06/04/2014 - 11/04/2014
Note
Validerad; 2015; Nivå 1; 20141119 (andbra)Available from: 2016-09-30 Created: 2016-09-30 Last updated: 2018-07-10Bibliographically approved
Organisations

Search in DiVA

Show all publications