The effect of vacuum assistance, mould temperature and ram velocity on the void transport and flow behaviour for sheet moulding compound (SMC) have been investigated with a design of experiment approach of the compression moulding phase. The relative amount of voids has been quantified with a high voltage insulation test and the flow behaviour has been quantified with image analysis of samples moulded with coloured SMC. In conclusion, the setting of high vacuum, low ram velocity and low mould temperature creates a homogeneous flow and minimises the amount of voids.