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Complementary results of non-destructive elemental assay and liberation analysis of waste printed circuit boards
Ecole Nationale Supérieure de Géologie, GeoRessources, University of Lorraine, Vandoeuvre-lès-Nancy, France; University of Engineering and Technology, Lahore, Punjab, Pakistan.
Facultad de Ingeniería y Ciencias, Universidad Adolfo Ibáñez, Peñalolén, Santiago, Chile.
Luleå University of Technology, Department of Civil, Environmental and Natural Resources Engineering, Geosciences and Environmental Engineering. Ecole Nationale Supérieure de Géologie, GeoRessources, University of Lorraine, Vandoeuvre-lès-Nancy, France; Facultad de Ingeniería y Ciencias, Universidad Adolfo Ibáñez, Peñalolén, Santiago, Chile; Neutron Beam Technology Team, RIKEN Center for Advanced Photonics, RIKEN, Wako, Saitama, Japan.ORCID iD: 0000-0002-8226-5883
2024 (English)In: Non-Destructive Material Characterization Methods / [ed] Otsuki, Akira; Jose, Seiko; Mohan, Manasa; Thomas, Sabu, Elsevier , 2024, p. 767-782Chapter in book (Other academic)
Place, publisher, year, edition, pages
Elsevier , 2024. p. 767-782
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Other Environmental Engineering Other Electrical Engineering, Electronic Engineering, Information Engineering
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Waste Science and Technology
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URN: urn:nbn:se:ltu:diva-102660DOI: 10.1016/B978-0-323-91150-4.00004-5Scopus ID: 2-s2.0-85176846448ISBN: 978-0-323-91150-4 (print)OAI: oai:DiVA.org:ltu-102660DiVA, id: diva2:1814103
Available from: 2023-11-23 Created: 2023-11-23 Last updated: 2024-03-07Bibliographically approved

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