Change search
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • harvard1
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf
PCB Integration of dye-sensitised solar cells for low-cost networked embedded systems
Luleå University of Technology, Department of Computer Science, Electrical and Space Engineering, Embedded Internet Systems Lab.ORCID iD: 0000-0001-9586-0991
Luleå University of Technology, Department of Computer Science, Electrical and Space Engineering, Embedded Internet Systems Lab.ORCID iD: 0000-0002-4133-3317
Monash University, Melbourne, VIC.
Monash University, Melbourne, VIC.
2011 (English)In: SENSORCOMM, 2011, p. 215-222Conference paper, Published paper (Refereed)
Abstract [en]

Wireless sensor networks are envisioned to make a large impact on how sensor data from physical phenomena can be utilized by millions of users on the Internet. However, one concern in deploying a large number of real-world physical sensors is that replacing spent batteries might not be feasible. One solution to this issue may involve energy harvesting technology, e.g. solar panels. Solar panels are currently relatively expensive because they require a time-consuming and therefore costly assembly process. As an alternative, this paper suggests a new approach to powering networked sensors: the direct integration of a solar cell onto the sensor nodes printed circuit board. This approach eliminates the need for manual assembly and the use of expensive connectors. This article presents test results and a feasibility analysis of the direct integration of a dye-sensitised solar cell onto a circuit board. Preliminary results indicate that this approach is feasible for networked sensors. The aim of this work is to develop a method for the assembly of complete systems, consisting of a printed circuit board, components, and power supply, using a single production process. The first steps towards this aim have been taken, and the authors believe that the proposed approach may be one enabling technology for future large-scale, low-cost wireless sensor networks.

Place, publisher, year, edition, pages
2011. p. 215-222
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Research subject
Industrial Electronics
Identifiers
URN: urn:nbn:se:ltu:diva-32013Local ID: 65e63da8-e5b7-4554-9fe7-47008ece1555ISBN: 978-1-61208-144-1 (electronic)OAI: oai:DiVA.org:ltu-32013DiVA, id: diva2:1005247
Conference
International Conference on Sensor Technologies and Applications : 21/08/2011 - 27/08/2011
Projects
iRoad
Note

Godkänd; 2011; 20111007 (jench)

Available from: 2016-09-30 Created: 2016-09-30 Last updated: 2017-11-25Bibliographically approved

Open Access in DiVA

No full text in DiVA

Other links

http://www.thinkmind.org/index.php?view=article&articleid=sensorcomm_2011_9_10_10168

Authority records BETA

Eliasson, JensDelsing, Jerker

Search in DiVA

By author/editor
Eliasson, JensDelsing, Jerker
By organisation
Embedded Internet Systems Lab
Other Electrical Engineering, Electronic Engineering, Information Engineering

Search outside of DiVA

GoogleGoogle Scholar

isbn
urn-nbn

Altmetric score

isbn
urn-nbn
Total: 215 hits
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • harvard1
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf