Temperature stabilization of electronics module
2006 (English)In: The IMAPS Nordic Annual Conference: September 17-19, 2006, Gothenburg, Sweden / [ed] Jarkko Kutilainen, Oslo: International Microelectronics and Packaging Society (IMAPS) Nordic, 2006, 97-103 p.Conference paper (Refereed)
Outdoor applications of electronics modules expose the systems to harsh environmental conditions. When very high performance is required, it may be necessary to actively stabilize the temperature in the module. This paper presents a systematic approach to the problem of designing a temperature stabilized environment for medium size electronics modules. The target system is the front-end electronics for the antennas in the EISCAT-3D incoherent scatter radar system. The electronics have an estimated constant power dissipation of about 10 W. Initially simulations verified the design approach and gave valuable information of the heat distribution in the box over the range of target temperatures. The design was evaluated by making a prototype on which different measurements were performed, which gave a clear picture of the system functionality. Using two Peltier modules and an insulated box a temperature stability of ±0.02°C at 20°C over an ambient temperature range of -40°C to 40°C was achieved.
Place, publisher, year, edition, pages
Oslo: International Microelectronics and Packaging Society (IMAPS) Nordic, 2006. 97-103 p.
Research subject Industrial Electronics
IdentifiersURN: urn:nbn:se:ltu:diva-35150ScopusID: 84866328704Local ID: 98f5f800-8ed0-11db-8975-000ea68e967bISBN: 9519800298OAI: oai:DiVA.org:ltu-35150DiVA: diva2:1008402
IMAPS Nordic Annual Conference : 17/09/2006 - 20/09/2006
Godkänd; 2006; 20061218 (ysko)2016-09-302016-09-30Bibliographically approved