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A compact ultrasonic transducer using the active piezoceramic material as electronics carrier
Luleå University of Technology, Department of Computer Science, Electrical and Space Engineering, Embedded Internet Systems Lab.
2004 (English)In: Ceramic interconnect technology: the next generation: Proceedings, American Ceramic Society, 2004Conference paper, Published paper (Refereed)
Abstract [en]

The integration of sensor and electronics is important to reduce size, cost and power consumption for a measurement system. Sensors based on piezoelectric ceramic materials traditionally have a low degree of sensor and electronics integration. This paper describes the design of a highly integrated ultrasound transmit/receive unit where the piezoceramic sensor is used as the carrier for the driver electronics. An optimized ASIC driver stage in bare die format and two lithium battery cells which give 6 V supply voltage are glued directly to the back side of the sensor. Electrical connections are made from the driver stage to the crystal using wire bond technology. Measurements have been performed with an air backed crystal and Plexiglas as the medium. The absence of long wiring and parasitic components between the driver stage and the driven crystal give excellent pulse control possibilities. The power consumption of the driver stage/crystal combination is linearly dependant on the repetition rate, with a current consumption of less than 20 μA at 1 kHz repetition rate. The approach taken introduces issues regarding the influence of vibrations in the MHz-range on die attachment and wire bonding connections, which need to be further investigated.

Place, publisher, year, edition, pages
American Ceramic Society, 2004.
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Research subject
Industrial Electronics
Identifiers
URN: urn:nbn:se:ltu:diva-38819Local ID: d54c6970-799e-11db-8824-000ea68e967bISBN: 0-930815-72-6 (print)OAI: oai:DiVA.org:ltu-38819DiVA: diva2:1012320
Conference
Ceramic Interconnect Technology Conference : 27/04/2004 - 28/04/2004
Note
Godkänd; 2004; 20060922 (ysko)Available from: 2016-10-03 Created: 2016-10-03 Last updated: 2017-10-19Bibliographically approved

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CiteExportLink to record
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  • apa
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