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SEQUENTIAL BUILD UP (SBU) OF PRINTED BOARDS USING A METALIZATION PROCESS BASED ON GRAFTING (THE CUPTRONIC PROCESS)
2014 (English)Independent thesis Basic level (professional degree), 10 credits / 15 HE creditsStudent thesis
Abstract [en]

The increasing demand for higher density electronics circuit boards calls fornew PWB technologies. One approach is the sequential build up of PWB. Thisthesis investigates the feasibility of Covalent Bounding Metallisation (CBM)technology to make small feature sizes on PWB’s.The approach is to define line geometries using standard photoresisttechnology and combing this with UV light activated grafting of the PWB surfaceenabling the growth of electroless copper onto the patterns defined by thephotoresist CBM process.The target PWB line widths has been 1 μm. Very preliminary results shows that10 μm is today possible.The work has involved certain difficulties related to stability of the electrolesscopper process and experimentation with the process steps involved in theCBM process.

Place, publisher, year, edition, pages
2014. , 31 p.
Keyword [en]
Technology, PCB, PWB, Sequential Build Up, Grafting Process, Full Additive Process, Electroless Copper, High Density Interconnect, Photoresist
Keyword [sv]
Teknik
Identifiers
URN: urn:nbn:se:ltu:diva-51243Local ID: 8766fa5f-03c6-4611-904e-1ad244434e59OAI: oai:DiVA.org:ltu-51243DiVA: diva2:1024605
Subject / course
Student thesis, at least 15 credits
Educational program
Electrical Engineering, bachelor's level
Supervisors
Note
Validerat; 20140731 (global_studentproject_submitter)Available from: 2016-10-04 Created: 2016-10-04Bibliographically approved

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Nava Valtuille, Miguel Rodrigo

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