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Encapsulation method for smallwireless measurement systems in high temperature environments
Luleå University of Technology, Department of Computer Science, Electrical and Space Engineering, Embedded Internet Systems Lab.ORCID iD: 0000-0003-4958-146X
Luleå University of Technology, Department of Computer Science, Electrical and Space Engineering, Embedded Internet Systems Lab.
Number of Authors: 22016 (English)Conference paper, Published paper (Refereed)
Abstract [en]

This paper presents an encapsulation concept that enables the construction of small wireless measurement systems that can operate in industrial environments with ambient temperatures of up to 1200°C. To maximize operational time and minimize size, a layer of thermal insulation is combined with water absorbed in a porous material in the core of the device. The simulated operating time before all of the frozen water at 0?C has transformed into steam at 100°C when the ambient temperature of the device was 1200°C is 21 minutes for a sphere with an outer radius of 4 cm. If the outer radius is increased to 10 cm the simulated operating time increases to 125 minutes. Measurements were performed to validate the design. When a sphere with a radius of 4 cm was subjected to an oven temperature of 1200°C the device held the core temperature at or below 101°C for a total of 25 minutes. The time to reach the boiling point of the water was 9 minutes. Thereafter, the temperature was held constant at 100 +/- 1°C for an additional 16 minutes whereafter a rapid rise in temperature took place once all water had evaporated.

Place, publisher, year, edition, pages
IMAPS-International Microelectronics and Packaging Society , 2016.
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Research subject
Industrial Electronics
Identifiers
URN: urn:nbn:se:ltu:diva-60878DOI: 10.4071/2016-HITEC-87Scopus ID: 2-s2.0-84995611743OAI: oai:DiVA.org:ltu-60878DiVA, id: diva2:1051548
Conference
IMAPS International Conference and Exhibition on High Temperature Electronics, HiTEC 2016, Albuquerque, 10-12 May 2016
Projects
Integrated Process Control based on Distributed In-Situ Sensors into Raw Material and Energy Feedstock, DISIRE
Funder
EU, Horizon 2020, 636834Available from: 2016-12-02 Created: 2016-12-02 Last updated: 2018-06-11Bibliographically approved

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Publisher's full textScopushttp://www.imapsource.org/doi/abs/10.4071/2016-HITEC-87

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Johansson, JonnyBorg, Johan

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