Change search
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • harvard1
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf
A novel production process for 10 μm microvias
Luleå University of Technology, Department of Computer Science, Electrical and Space Engineering, Embedded Internet Systems Lab.ORCID iD: 0000-0002-4897-5603
Luleå University of Technology, Department of Computer Science, Electrical and Space Engineering, Embedded Internet Systems Lab.ORCID iD: 0000-0002-4133-3317
2017 (English)In: IMAPS 2017, USA: International Microelectronics and Packaging Society (IMAPS), 2017, , p. 5Conference paper, Published paper (Refereed)
Abstract [en]

This work investigates the capability of drilling and metallization of microvias of diameter less than 10 µm with aspect ratios of 1-10, using a fully additive process.

The microvia has been produced using a sequential build up layer of urethane through which the via has been produced. The urethane layer is applied using spin-coating. Current process setting produces a 15 µm layer thickness. For thicker urethane, multiple layers are applied. Drilling of the via-hole through is made using 266 nm UV laser.

The metallisation of the via-hole was made using a process called Covalent Bonded Metallisation (CBM).

This process modifies the urethane surface by a grafting process where polymers are covalently bonded to the

surface where metallisation is desired. A roughly 5 µm thin film of the used grafting solution is applied to the substrate surface. The grafting process is initiated by laser which draws the patterns where copper is desired.

After laser drawing, the substrate is cleaned with deionized water. Next, the substrate is through a commercial

chemical-copper process which builds copper only at the laser initiated patterns. Copper thicknesses of 1 µm is easily achievable. To increase the copper thickness, the substrate may be run into thick building chemical-copper process to achieve thicknesses up to 8 µm.

Place, publisher, year, edition, pages
USA: International Microelectronics and Packaging Society (IMAPS), 2017. , p. 5
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Research subject
Industrial Electronics
Identifiers
URN: urn:nbn:se:ltu:diva-65779OAI: oai:DiVA.org:ltu-65779DiVA, id: diva2:1143912
Conference
50th International Symposium on Microelectronics, Raleigh, NC USA, Oct. 9-12, 2017
Available from: 2017-09-23 Created: 2017-09-23 Last updated: 2018-05-28Bibliographically approved

Open Access in DiVA

fulltext(1458 kB)10 downloads
File information
File name FULLTEXT01.pdfFile size 1458 kBChecksum SHA-512
038fb6aaf760ab7b76ae8a3c38268fb1c5bc67887d4334cb1c4381f2fcc53bb3a1702aa03d08f6ab85f055678d0d4d3c56657d18a280ac3d0e6c6aef72b280bf
Type fulltextMimetype application/pdf

Authority records BETA

Renbi, Abdelghani

Search in DiVA

By author/editor
Renbi, AbdelghaniDelsing, Jerker
By organisation
Embedded Internet Systems Lab
Other Electrical Engineering, Electronic Engineering, Information Engineering

Search outside of DiVA

GoogleGoogle Scholar
Total: 10 downloads
The number of downloads is the sum of all downloads of full texts. It may include eg previous versions that are now no longer available

urn-nbn

Altmetric score

urn-nbn
Total: 104 hits
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • harvard1
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf