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Factors affecting weld root morphology in laser keyhole welding
Luleå University of Technology, Department of Engineering Sciences and Mathematics, Product and Production Development.ORCID iD: 0000-0003-4265-1541
2018 (English)In: Optics and lasers in engineering, ISSN 0143-8166, E-ISSN 1873-0302, Vol. 101, 89-98 p.Article in journal (Refereed) Published
Abstract [en]

Welding production efficiency is usually optimised if full penetration can be achieved in a single pass. Techniques such as electron and laser beam welding offer deep high speed keyhole welding, especially since multi-kilowatt lasers became available. However, there are limitations for these techniques when considering weld imperfections such as weld cap undercuts, interior porosity or humps at the root. The thickness of sheets during full penetration welding is practically limited by these root humps. The mechanisms behind root morphology formation are not yet satisfactory understood. In this paper root humping is studied by reviewing previous studies and findings and also by sample examination and process observation by high speed imaging. Different process regimes governing root quality are presented, categorized and explained. Even though this study mainly covers laser beam and laser arc hybrid welding, the presented findings can generally be applied full penetration welding in medium to thick sheets, especially the discussion of surface tension effects. As a final result of this analysis, a map of methods to optimise weld root topology is presented.

Place, publisher, year, edition, pages
Elsevier, 2018. Vol. 101, 89-98 p.
National Category
Manufacturing, Surface and Joining Technology
Research subject
Manufacturing Systems Engineering
Identifiers
URN: urn:nbn:se:ltu:diva-66247DOI: 10.1016/j.optlaseng.2017.10.005ISI: 000416499200012Scopus ID: 2-s2.0-85031996479OAI: oai:DiVA.org:ltu-66247DiVA: diva2:1152465
Note

Validerad; 2017; Nivå 2; 2017-10-25 (andbra)

Available from: 2017-10-25 Created: 2017-10-25 Last updated: 2017-12-14Bibliographically approved

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