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Material Impulse Response Estimation from Overlapping Ultrasound Echoes Using a Compressed Sensing Technique
Luleå University of Technology, Department of Computer Science, Electrical and Space Engineering, Signals and Systems.ORCID iD: 0000-0002-6216-6132
Luleå University of Technology, Department of Computer Science, Electrical and Space Engineering, Signals and Systems. Rubico Vibration Analysis AB.ORCID iD: 0000-0001-6687-7794
Rubico Vibration Analysis AB.
2017 (English)In: IEEE International Ultrasonics Symposium, IUS, IEEE Computer Society, 2017, article id 8091788Conference paper, Published paper (Refereed)
Abstract [en]

When investigating thin materials with pulse echo ultrasound, multiple reflections (reverberations) from the layer(s) will overlap. It is therefore difficult to deduce information about speed of sound, thickness, density, etc. from the raw data. In order to extract this information, the overlapping pulses must be either decoupled or we must find some model of the material sample describing the wave propagation. It is, however, often reasonable to assume that the the number of reflections is small relative to the number of samples in the record signal of interest. In other words, the system describing the reverberations is sparse. In this paper we investigate, with simulations and with experiments on a 4.8 and 2.2 mm thick glass plate, respectively, how the framework of compressed sensing can be adopted in order to retrieve the impulse response of the material specimen

Place, publisher, year, edition, pages
IEEE Computer Society, 2017. article id 8091788
Series
IEEE International Ultrasonics Symposium, ISSN 1948-5719, E-ISSN 1948-5727
Keywords [en]
Glass, Ultrasonic imaging, Compressed sensing, Reverberation, Transducers, Shape, Ultrasonic variables measurement
National Category
Signal Processing
Research subject
Signal Processing
Identifiers
URN: urn:nbn:se:ltu:diva-67246DOI: 10.1109/ULTSYM.2017.8091788ISI: 000416948400102Scopus ID: 2-s2.0-85039445752ISBN: 978-1-5386-3383-0 (electronic)ISBN: 978-1-5386-3384-7 (print)OAI: oai:DiVA.org:ltu-67246DiVA, id: diva2:1173177
Conference
2017 IEEE International Ultrasonics Symposium (IUS), Washington D.C., 6-9 Sept. 2017
Available from: 2018-01-11 Created: 2018-01-11 Last updated: 2018-12-06Bibliographically approved

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Carlson, Johan E.Ovacikli, Aziz Kubilay

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