Study on continuous cold-pressing technology of engineered wood flooring with EPI adhesiveShow others and affiliations
2018 (English)In: Wood research, ISSN 1336-4561, Vol. 63, no 2, p. 335-342Article in journal (Refereed) Published
Abstract [en]
The effects of process parameters (adhesive spread, press time, and applied pressure) on the gluing performance of engineered wood flooring bonded with emulsion-polymer-isocyanate (EPI) adhesive were studied. The results showed (shear strength and aging test) that the major factors were adhesive spread and press time. The optimized parameters for best gluing performance of engineered wood flooring were 160 g.m-2, 14 s, and 60 s for adhesive spread, heat time, and press time, respectively, within certain ranges
Place, publisher, year, edition, pages
Statny Drevarsky Vyskumny Ustav , 2018. Vol. 63, no 2, p. 335-342
National Category
Other Mechanical Engineering
Research subject
Wood Science and Engineering
Identifiers
URN: urn:nbn:se:ltu:diva-68853ISI: 000432579000014Scopus ID: 2-s2.0-85046712217OAI: oai:DiVA.org:ltu-68853DiVA, id: diva2:1209334
Note
Validerad;2018;Nivå 2;2018-05-22 (andbra)
2018-05-222018-05-222018-06-08Bibliographically approved