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Scalability of Copper-Interconnects down to 3μm on Printed Boards by Laser-assisted-subtractive process
Luleå University of Technology, Department of Computer Science, Electrical and Space Engineering, Embedded Internet Systems Lab.
Luleå University of Technology, Department of Computer Science, Electrical and Space Engineering, Embedded Internet Systems Lab.
Luleå University of Technology, Department of Computer Science, Electrical and Space Engineering, Embedded Internet Systems Lab.ORCID iD: 0000-0002-4133-3317
2019 (English)In: Proceedings of: 2019 IMAPS Nordic Conference on Microelectronics Packaging (NordPac), IEEE, 2019, p. 206-209Conference paper, Published paper (Refereed)
Abstract [en]

As per the latest roadmap of iNEMI, the global electronics market is emphasizing to identify disruptive technologies that can contribute towards denser, robust and tighter integration on the board level. Therefore, reduction in packaging factor of printed board can accommodate greater number of ICs to support miniaturization. This paper has shown an experimental method to pattern the metallic layer on a Printed circuit Board (PCB) to the smallest feature size. To investigate this, a commercially available FR-4 PCB with photosensitive material coat and a Copper (Cu) layer on it, is used. A reverse-mode Laser assisted writing is implemented to pattern the desired copper tracks. Soon after, a well-controlled development and chemical etching of the Laser-activated regions are done using Sodium Hydroxide solution followed by an aqueous solution of Sodium Persulfate. Current PCB interconnects used by the industries are of the order (~20 μm). Whereas the present work is a contribution towards achieving Copper interconnects with feature size 3.0μm. This miniaturization corresponds to 70% reduction in the feature size from 20 μm to 3μm. The natural adhesion of the Cu layer has remained intact even after the etching, shows the efficiency of the method adopted. Also, variation in the parameters such as etching time, etchant solution concentrations, temaperature, gain and exposure time of Laser beam and their corresponding effects are discussed. Other highlights of this subtractive method includes its cost-efficiency, lesser production time and repeatability.

Place, publisher, year, edition, pages
IEEE, 2019. p. 206-209
Keywords [en]
Subtractive process, FR-4 PCB, Laser assisted writing, etching, copper tracks, reverse-mode
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Research subject
Electronic systems
Identifiers
URN: urn:nbn:se:ltu:diva-75980DOI: 10.23919/NORDPAC.2019.8760349OAI: oai:DiVA.org:ltu-75980DiVA, id: diva2:1350938
Conference
2019 IMAPS Nordic Conference on Microelectronics Packaging (NordPac), 11-13 June 2019, Copenhagen, Denmark
Available from: 2019-09-12 Created: 2019-09-12 Last updated: 2019-09-12Bibliographically approved

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Acharya, SarthakChouhan, Shailesh SinghDelsing, Jerker

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