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Nano SiC enhancement in the BN micro structure for high thermal conductivity epoxy composite
School of Materials Science and Engineering, Tianjin University, 300350, Tianjin, People’s Republic of China.
School of Materials Science and Engineering, Tianjin University, 300350, Tianjin, People’s Republic of China.
School of Chemical Engineering and Technology, State Key Laboratory for Chemical Engineering, Tianjin University, 300350, Tianjin, People’s Republic of China.
Luleå University of Technology, Department of Engineering Sciences and Mathematics, Machine Elements.ORCID iD: 0000-0001-6085-7880
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2021 (English)In: Journal of polymer research, ISSN 1022-9760, E-ISSN 1572-8935, Vol. 28, no 10, article id 387Article in journal (Refereed) Published
Abstract [en]

Improving the heat dissipation efficiency of electronic products is the key to the design of many modern electronic and mechanical systems. Herein, we combined the 3D network fabricating with the way of micron-nano reinforcement to prepare high thermal conductivity and excellent thermal stability composites. Epoxy resin was used as the matrix, while the silicon carbide foam (f-SiC) as skeleton and the BN/nano-SiC as thermally conductive fillers. The thermal conductivity of the EP/f-SiC/BN/nano-SiC composite reaches 3.5 W·m− 1·K− 1, which is about 16.6 times higher than that of pure epoxy resin. The characterization results of TC and infrared thermography images indicate that the EP/f-SiC/BN/nano-SiC composite possess superior heat transport performance. Meantime, the EP/f-SiC/BN/nano-SiC composite have excellent thermal stability, the THRI of EP/f-SiC/BN/nano-SiC reaches 195.8℃, which is 21.3℃ higher than that of pure EP. This work would provide a new strategy for improving the TC of polymers by using other 3D skeletons and micron-nano fillers, and is conducive to the development of high thermal conductivity and excellent thermal stability materials. 

Place, publisher, year, edition, pages
Springer, 2021. Vol. 28, no 10, article id 387
Keywords [en]
Thermal conductivity, Epoxy resin, SiC foam, Micron-nano reinforcement, Composites
National Category
Composite Science and Engineering
Research subject
Machine Elements
Identifiers
URN: urn:nbn:se:ltu:diva-87234DOI: 10.1007/s10965-021-02755-zISI: 000728293600004Scopus ID: 2-s2.0-85115172698OAI: oai:DiVA.org:ltu-87234DiVA, id: diva2:1597716
Note

Validerad;2021;Nivå 2;2021-09-27 (alebob);

Funder: National Science Foundation for Distinguished Young Scholars of China (51925403); Major Research Plan of the National Natural Science Foundation of China (91934302); National Science Foundation of China (21676052, 21606042); State Key Laboratory of Chemical Engineering (SKL-ChE-20T07); Laboratory Open Fund of Beijing Smart-chip Microelectronics Technology Co., Ltd.

Available from: 2021-09-27 Created: 2021-09-27 Last updated: 2023-05-08Bibliographically approved

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Shi, Yijun

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