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Micro Service based Sensor Integration Efficiency and Feasibility in the Semiconductor Industry
Infineon Technologies Dresden GmbH & Co. KG Dresden, Germany.
University of Applied Sciences Dresden, Dresden, Germany.
Infineon Technologies Dresden GmbH & Co. KG Dresden, Germany.
University of Applied Sciences Dresden, Dresden, Germany.
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2022 (English)In: Infocommunications Journal, ISSN 2061-2079, Vol. 14, no 3, p. 79-85Article in journal (Refereed) Published
Abstract [en]

The semiconductor industry is strongly increasing the production capacities and the product portfolio for a wide range of applications that are needed in the worldwide supply chains e.g. the automotive, computer and security industry. The complex manufacturing processes require more automation, dig- italisation and IoT frameworks, especially for highly automated semiconductor manufacturing plants. Over the last years, this industry spent much effort to control highly sensitive materials in production by product monitoring using advanced process control by various sensors in production. Nevertheless, until today, sensor integration, especially for such sensors that are not supported by the equipment vendors, is time-consuming and complicated. This article aims to use a micro-service-based approach by Eclipse Arrowhead as an open-source microservice architecture and implementation platform [1]. This architecture is an easy and powerful framework that can be used for multiple sensor applications to control the manufacturing material flow in a modern semiconductor plant with a high product mix. The article describes how the engineering process was designed, the architecture of the use case and the main benefits in the operational business are shown.

Place, publisher, year, edition, pages
Scientific Association for Infocommunications , 2022. Vol. 14, no 3, p. 79-85
Keywords [en]
Digitalisation, Eclipse Arrowhead, Engineering Process, Industry4.0, IoT Frameworks, Micro Services, Sensor-integration
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Research subject
Cyber-Physical Systems
Identifiers
URN: urn:nbn:se:ltu:diva-94659DOI: 10.36244/ICJ.2022.3.10ISI: 000910085000011Scopus ID: 2-s2.0-85142720349OAI: oai:DiVA.org:ltu-94659DiVA, id: diva2:1716338
Projects
Arrowhead Tools
Funder
EU, Horizon 2020, 826452 ECSEL
Note

Godkänd;2022;Nivå 0;2022-12-05 (hanlid)

Available from: 2022-12-05 Created: 2022-12-05 Last updated: 2023-02-24Bibliographically approved

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Delsing, Jerker

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