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Scalability of Copper-Interconnects down to 3μm on Printed Boards by Laser-assisted-subtractive process
Acharya, Sarthak
Luleå University of Technology, Department of Computer Science, Electrical and Space Engineering, Embedded Internet Systems Lab.
ORCID iD:
0000-0001-8774-9433
Chouhan, Shailesh Singh
Luleå University of Technology, Department of Computer Science, Electrical and Space Engineering, Embedded Internet Systems Lab.
ORCID iD:
0000-0002-6055-3198
Delsing, Jerker
Luleå University of Technology, Department of Computer Science, Electrical and Space Engineering, Embedded Internet Systems Lab.
ORCID iD:
0000-0002-4133-3317
2019 (English)
In:
IMAPS 2019 NordPac Conference – Lyngby, Denmark, International Microelectronics and Packaging Society (IMAPS), 2019, p. 17-20
Conference paper, Published paper (Refereed)
Place, publisher, year, edition, pages
International Microelectronics and Packaging Society (IMAPS), 2019. p. 17-20
Series
IMAPSource Proceedings ; 2019:NOR
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Research subject
Electronic Systems
Identifiers
URN:
urn:nbn:se:ltu:diva-105551
DOI:
10.4071/2380-4491-2019-NOR-Acharya
Scopus ID:
2-s2.0-85188917935
OAI: oai:DiVA.org:ltu-105551
DiVA, id:
diva2:1859423
Conference
IMAPS Nordic 2019, Nordic Conference on Microelectronics Packaging (NordPac 2019), Lyngby, Denmark, June 11-13, 2019
Note
Funder: European Project: Productive 4.0
Available from:
2024-05-21
Created:
2024-05-21
Last updated:
2024-05-21
Bibliographically approved
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Acharya, Sarthak
Chouhan, Shailesh Singh
Delsing, Jerker
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