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Highly porous open cellular TiAl-based intermetallics fabricated by thermal explosion with space holder process
School of Materials Science and Engineering, China University of Mining and Technology, Xuzhou.
School of Materials Science and Engineering, China University of Mining and Technology, Xuzhou.
School of Materials Science and Engineering, China University of Mining and Technology, Xuzhou.
School of Materials Science and Engineering, China University of Mining and Technology, Xuzhou.
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2016 (English)In: Intermetallics (Barking), ISSN 0966-9795, E-ISSN 1879-0216, Vol. 68, p. 95-100Article in journal (Refereed) Published
Abstract [en]

High porosity TiAl-based intermetallics were prepared through thermal explosion (TE) from Ti–50Al at.% powders with NaCl as soluble template. The results showed that the space holder particles of NaCl were removed completely in green compacts, and porous Ti–Al materials were synthesized via a low-energy consumption method of TE at a temperature of 600 °C. TiAl was evolved as dominant phase in sintered materials at 1100 °C. With adding 80 vol.% NaCl to Ti–50Al at.% powders, the open porosity was significantly elevated up to 84%. Moreover, the porous materials exhibited a bimodal pore size distribution: large pores (200–500 μm) replicating NaCl particles and small pores (<50 μm) embedded in pore walls. The interconnected small and large pores make open cellular porous TiAl materials, which prescribe them promising for a wide range of applications in separation, heat insulation and catalysis.

Place, publisher, year, edition, pages
2016. Vol. 68, p. 95-100
National Category
Other Materials Engineering
Research subject
Engineering Materials
Identifiers
URN: urn:nbn:se:ltu:diva-8493DOI: 10.1016/j.intermet.2015.09.010ISI: 000364896500014Scopus ID: 2-s2.0-84943556885Local ID: 702000d1-593f-4ea6-aae4-a3b3ddbb53caOAI: oai:DiVA.org:ltu-8493DiVA, id: diva2:981431
Note
Validerad; 2016; Nivå 2; 20151006 (andbra)Available from: 2016-09-29 Created: 2016-09-29 Last updated: 2018-07-10Bibliographically approved

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Akhtar, Farid

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