The growing demand for electrification increases the likelihood of airport system interferencecaused by electromagnetic emissions. Studies have shown that equipment, installations, andvehicles (including trains, cars, and aircraft) may exceed emissions limits established by manyairports. While minor airport system disruptions, such as radio noise squelch, have been presentfor years, rising emissions may pose risks to critical radio communication and navigationsystems potentially leading to severe consequences.

This work provides an overview of airport-related electromagnetic emission standards, comparingproduct-specific standards with current airport emission regulations. The analysisevaluates emission limits across various standards, emphasizing measurement methods, such asdistance, bandwidth, and detectors, alongside their underlying principles. The paper outlineskey challenges which may impact airport operations as electrification expands within both theairport environment and aircraft themselves.

Results highlight the complexity of diverse airport environments, showing that a single standardacross an entire airport is impractical. Some equipment will inevitably produce emissions,making product (family) standards, which are hierarchically superior to generic ones, a priority.Notably, road vehicles, high-power equipment and electronic discharge machining productsmay emit significantly more than current regulations permit. Furthermore do preliminarymeasurements indicate that electrically propelled aircraft, airport installations and ground powerunits generate substantial emissions, with high likelihood exceeding defined limits.

Overall, the findings presented indicate that further investigations are relevant for standardisation,its implementation, and the impact of emissions from various sources on airport operations.

Fast semiconductor switches in modern electric drive systems contribute to increased overall system efficiency. However, rapid voltage transitions, dv/dt’s, can lead to overvoltage, bearing currents, and electromagnetic interference (EMI). A second-order low-pass LC filter can reduce the dv/dt’s but will introduce overvoltage on the motor phase due to resonance. This paper presents an experimental hardware implementation to mitigate this phenomenon by the use of a PWM strategy and a control algorithm. The PWM strategy aims to suppress LC filter resonance by inserting additional pulses at the rising and falling edges of the PWM waveform, while the control algorithm determines the optimal switching instants for these pulses. The control algorithm reduced resonance, but small residual oscillations persisted, which became more noticeable with system variations. Nevertheless, experimental results demonstrated that the PWM strategy successfully suppressed resonance, thereby confirming the effectiveness of the hardware setup.

The use of inverter-based motor controllers that can generate fast voltage level transitions is increasing in the field of electric drive systems because of their ability to achieve higher efficiency. However, the fast voltage transitions, dv/dt's, are prone to generate bearing currents and cause overvoltages that may harm the electric motor. An LC filter applied between the inverter and the motor terminals can reduce the dv/dt's. However, the LC filter will cause overvoltage due to resonance but this can be overcome by introducing an extra pulse at each pulse-width modulation (PWM) transition. The timing of this extra pulse is crucial for suppressing the resonance, but due to nonlinearities in a real system, the time instants may vary over time and are thus in need of control. In this study, an analytical expression for the optimal pulse location and duration is derived and we propose a control algorithm that continuously calculates the optimal pulse switch time instants based on the measured output voltage. The control algorithm can handle sudden system disturbances and a Monte Carlo simulation is performed to evaluate the performance of the algorithm. This hybrid filter successfully reduces dv/dt's at the motor terminals while simultaneously eliminating overvoltages due to the filter resonance.

This paper presents a theory for the power transfer efficiency of printed circuit board coils to integrated circuit coils, with focus on load-dependence for low-power single-chip systems. The theory is verified with electromagnetic simulations modelled on a 350 nm CMOS process which in turn are verified by measurements on manufactured integrated circuits. The power transfer efficiency is evaluated by on-chip rectification of a 151 MHz signal transmitted by a spiral coil on a printed circuit board at 10 mm of separation to an on-chip coil. Such an approach avoids the influence of off-chip parasitic elements such as bond wires, which would reduce the accuracy of the evaluation.

It is found that there is a lower limit for the load below which reducing the power consumption of on-chip circuits yield no increase in voltage generated at the load. For the examined process technology, this limit appears to lie around 56 kΩ. The paper is focused on the analysis and verification of the theory behind this limit.

We relate the results presented in this work to the application of wireless single-chip temperature monitoring of power semiconductors and conclude that such a system would be compatible with this limit.

This paper presents a circuit for realising a fuse-programmable capacitor on-chip. The trimming mechanism is implemented using integrated circuit fuses which can be blown in order to lower the resulting equivalent capacitance. However, for integrated circuits, the non-zero fuse resistance for active fuses and finite fuse resistance for blown fuses limit the Q factor of the resulting capacitor. In this work, we present a method on how to arrange the fuses in order to achieve maximal worst-case Q factor for the given circuit topology given the process parameters and requirements on capacitance. We also analyse and discuss the accuracy and limitations of the topology with regard to fuse resistance and parasitic elements such as bond pads.

This paper presents electromagnetic simulations of a wireless power transfer system suitable for a monitoring system for detection of solder fatigue in power semiconductor modules. Power is provided wirelessly from a printed spiral coil on a printed circuit board to a silicon chip with an on-chip coil. We use and adapt a known gradient-ascent-based optimisation algorithm to obtain suitable coil geometries. For a frequency of 433 MHz, the simulations show an efficiency of -34.7 dB which we conclude is sufficient for the proposed monitoring system.

Efficient beamforming of phased-array antennas requires that the phase delay of each channel is accurately known. One technique for achieving this is to distribute a calibration or local-oscillator reference signal through a delay-insensitive signal distribution network. In this paper, we propose using passive hierarchical signal distribution networks to distribute such signals, a method that scales significantly better with the size of the array than existing signal distribution methods. We analyze the impact of impedance variations within the network on the phase accuracy and propose a calibration front-end architecture. This front end also enables the return loss and coupling between antennas to be monitored for diagnostic purposes. We present an implementation of this front end that was applied to a small prototype antenna array, and show that this implementation exhibited low sensitivity to delays within the calibration network, reduced the temperature-dependent phase error of the front ends substantially, and can be used for performing antenna return-loss measurements

This paper analyses leakage current compensation techniques for low-power, bandgap temperature sensors. Experiments are conducted for circuits that compensate for collector-substrate, collector-base, body-drain and source-body leakage currents in a Brokaw bandgap sensor. The sensors are characterised and their failure modes are analysed at temperatures from 60 to 230∘C">230 ∘ C 230∘C . It is found that the most appropriate compensation circuit depends on the accuracy requirements of the application and on whether a stable reference voltage is required by other parts of the circuit. Experiments show that the power consumption is dominated by leakage current at high temperatures. One type of sensor was seen to consume 260 nW at 60∘C">60 ∘ C 60∘C , 2.1μW">2.1μW 2.1μW at 200∘C">200 ∘ C 200∘C and 14μW">14μW 14μW at 230∘C">230 ∘ C 230∘C . This work is motivated by the need to accurately monitor the temperature of power semiconductors in order to predict emerging faults in power semiconductor modules, a task for which cheap, single-chip, low-power, high-temperature, wireless bandgap temperature sensors are appropriate.