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Engineering Precision: Advancing the Reliability of BGA Solder Joints in Automotive Applications
Luleå University of Technology, Department of Civil, Environmental and Natural Resources Engineering, Operation, Maintenance and Acoustics. Mälardalen University, Eskilstuna, Sweden.ORCID iD: 0000-0002-7458-6820
2025 (English)In: IEEE Reliability Magazine, E-ISSN 2641-8819, Vol. 2, no 1, p. 27-33Article in journal, Editorial material (Other academic) Published
Abstract [en]

From controlling engine performance to enabling life-saving advanced driver-assistance systems (ADAS), the modern vehicle relies on a network of electronic systems that demand exceptional precision and reliability. At the heart of these systems are ball grid arrays (BGAs)—the tiny solder joints that provide the electrical and mechanical connections essential for smooth operation (see Figure 1). While they may be invisible to the casual observer, BGAs are integral to automotive technology.

Yet, as vehicles become more intelligent, interconnected, and electrified, the demands on BGAs grow. Extreme environments, continuous operation, and evolving functionality challenge their reliability at every turn. How can the automotive industry ensure these vital components remain robust under such relentless stress? This article dives into the challenges BGAs face and the innovations redefining their reliability

Place, publisher, year, edition, pages
IEEE, 2025. Vol. 2, no 1, p. 27-33
National Category
Robotics and automation
Research subject
Operation and Maintenance Engineering
Identifiers
URN: urn:nbn:se:ltu:diva-111601DOI: 10.1109/mrl.2024.3523859OAI: oai:DiVA.org:ltu-111601DiVA, id: diva2:1936766
Note

Godkänd;2025;Nivå 0;2025-03-20 (u8);

Available from: 2025-02-11 Created: 2025-02-11 Last updated: 2025-10-21Bibliographically approved

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Lin, Jing

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